Method for temporary plating of flexible substrates for microtechnologies

Presentation

This new method of temporal rigidification of flexible films enables their structuration, metallization, layer deposit by centrifugal coating, bathing, printing(…), to modify the substrate's surface. This flexible film structuration can be performed homogeneously on large surfaces.

Competitive advantages

• A µm pattern precision is reached by UV lithography;
• Homogeneous surface of the final product;
• Lower reject rate during manufacturing;
• Lower manufacturing costs;
• Usual microelectronic equipment (rigid substrate) is used for a flexible substrate application.
  

Applications/Markets

• Microelectronics on flexible substrate;
• Microtechnologies, for example: Flexible sensors of deformation, stress, curvature, vibration…
• LED and OLED on a flexible substrate.
  

Intellectual property

• Secret expertise.

Laboratory

Institut Jean Lamour