Non intrusive component junction temperature measurement method

DESCRIPTION

• Temperature measurement made into the driver board
• Measurement method based on the thermal sensitivityof a component intrinsic characteristic:
  - Current injection and insulation at chip terminals
  - Coupled with an acquisition and treatment system
• Accurate measurement enabling operating specifications optimization
• Real time measurement of any standard power devices

APPLICATIONS

• Real-time monitoring (on-line)
• Specific diagnostic (off-line)
• Ageing & damages study of power devices & packaging
• Industries:
  - Oil & drilling
  - Power generation
  - Aeronautics
  - Automotive